You are currently exploring our in-stock options for part number X28C256BEMB-15 with the NSN 5962013711029. This product is listed with the description “Microcircuit Memory” and is manufactured by Xicor Inc. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number X28C256BEMB-15 is listed alongside the NSN 5962-01-371-1029 and belongs to the FSC 5962 Microcircuits Electronic. Additionally, it is also under the CAGE Code 60395, which is assigned to Xicor Inc. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number X28C256BEMB-15 seamless.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-371-1029 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013711029 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| X28C256BEMB-15 | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | EEPROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.2 VOLTS MAXIMUM POWER SOURCE |
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ERASABLE AND PROGRAMMABLE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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