You are currently exploring our in-stock options for part number P4C1257-25LMB with the NSN 5962014081092. This product is listed with the description “Microcircuit Memory” and is manufactured by Performance Semiconductor Corp. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number P4C1257-25LMB is listed alongside the NSN 5962-01-408-1092 and belongs to the FSC 5962 Microcircuits Electronic. Additionally, it is also under the CAGE Code 75569, which is assigned to Performance Semiconductor Corp. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number P4C1257-25LMB seamless.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-408-1092 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014081092 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
5962-88725 | 5 | 1 | 4 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.000 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM ABSOLUTE OUTPUT" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE" |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 OUTPUT PICOFARADS MAXIMUM" |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
CZER | MEMORY DEVICE TYPE | RAM" |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC" |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS" |
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.120 INCHES MAXIMUM" |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.000 WATTS" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM ABSOLUTE OUTPUT" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE" |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 12.00 OUTPUT PICOFARADS MAXIMUM" |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
CZER | MEMORY DEVICE TYPE | RAM" |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC" |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS" |
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