You are currently exploring our in-stock options for part number 588R098H01 with the NSN 5962013328594. This product is listed with the description “Microcircuit Memory” and is manufactured by Northrop Grumman Systems Corporation. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number 588R098H01 is listed alongside the NSN 5962-01-332-8594 and belongs to the FSC 5962 Microcircuits Electronic. Additionally, it is also under the CAGE Code 97942, which is assigned to Northrop Grumman Systems Corporation. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number 588R098H01 seamless.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-332-8594 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013328594 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| MT5C66408F-25/883C | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAT | BODY WIDTH | 0.340 INCHES MINIMUM AND 0.380 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-11 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAQ | BODY LENGTH | 0.740 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
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