You are currently exploring our in-stock options for part number 7186674 002 with the NSN 5950015789923. This product is listed with the description “Shielding Bead Electronic” and is manufactured by L 3 Communications Corporation. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number 7186674 002 is listed alongside the NSN 5950-01-578-9923 and belongs to the FSC 5950 Coils and Transformers. Additionally, it is also under the CAGE Code 06401, which is assigned to L 3 Communications Corporation. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number 7186674 002 seamless.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5950-01-578-9923 Item PartTypeName: SHIELDING BEAD,ELECTRONIC | 5950 | 015789923 | 0 | P | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 7186674-002 | 5 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MRC | Decoded Requirement | Clear Text Reply |
| FEAT | Special Features | CHIP BEAD (IMPEDER), MMZ SERIES OFFERS 4 CONSTRUCTION MATERIALS; SIZE STANDARIZED FOR USE BY AUTOMATIC ASSEMBLY EQUIPMENT; NO PREFERRED ORIENTATION; EITHER FLOW OR REFLOW SOLDERING METHODS CAN BE USED DUE TO ELECTROPLATING OF THE TERMINAL ELECTRODES; HIGH RELIABILITY DUE TO AN ENTIRELY MONOLITHIC STRUCTURE; CLOSED MAGNETIC CIRCUIT STRUCTURE ALLOWS HIGH-DENSITY INSTALLATION WHILE PREVENTING CROSSTALK BETWEEN CIRCUITS; LOW DC RESISTANCE STRUCTURE OF ELECTRODE PREVENTS WASTEFUL ELECTRIC POWER CONSUMPTION; CONTAINS NO LEAD AND ALSO SUPPORT LEAD-FREE SOLDERING; CONFORMING TO ROHS DIRECTIVE |
| CXCY | Part Name Assigned By Controlling Agency | CHIP BEADS(SMD) FOR SIGNAL LINE |
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