You are currently exploring our in-stock options for part number HMC241QS16 with the NSN 5962015765546. This product is listed with the description “Microcircuit Linear” and is manufactured by Hittite Microwave Corporation. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number HMC241QS16 is listed alongside the NSN 5962-01-576-5546 and belongs to the FSC 5962 Microcircuits Electronic. Additionally, it is also under the CAGE Code 1CN88, which is assigned to Hittite Microwave Corporation. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number HMC241QS16 seamless.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-576-5546 Item PartTypeName: MICROCIRCUIT,LINEAR | 5962 | 015765546 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 91793093 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | Part Name Assigned By Controlling Agency | GAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ |
| FEAT | Special Features | PACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C; NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND |
| MRC | Decoded Requirement | Clear Text Reply |
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