You are currently exploring our in-stock options for part number QFCH-5274 with the NSN 5961013828087. This product is listed with the description “Semiconductor Device Set” and is manufactured by Hewlett-Packard Company. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number QFCH-5274 is listed alongside the NSN 5961-01-382-8087 and belongs to the FSC 5961 Semiconductor Devices and Associated Hardware. Additionally, it is also under the CAGE Code 54893, which is assigned to Hewlett-Packard Company. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number QFCH-5274 seamless.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-382-8087 Item PartTypeName: SEMICONDUCTOR DEVICE SET | 5961 | 013828087 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | G | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
899857-6 | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ASKA | COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
BBJD | FIELD FORCE EFFECT TYPE | RADIOACTIVE SOURCE |
FEAT | SPECIAL FEATURES | COMPONENT SHALL CONSIST OF A SET OF FOUR DIODES WITH FORWARD VOLTAGES MATCHED WITHIN /-3.0 MILLIVOLTS AT 10.0 MILLIAMPERES |
TTQY | TERMINAL TYPE AND QUANTITY | 2 TAB,SOLDER LUG ALL SEMICONDUCTOR DEVICE DIODE |
ABHP | OVERALL LENGTH | 0.070 INCHES NOMINAL ALL SEMICONDUCTOR DEVICE DIODE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 0.390 MAXIMUM FORWARD VOLTAGE,DC ALL SEMICONDUCTOR DEVICE DIODE |
CTRD | POWER RATING PER CHARACTERISTIC | 0.5 WATTS MAXIMUM PULSE RF POWER ALL SEMICONDUCTOR DEVICE DIODE |
ABBH | INCLOSURE MATERIAL | METAL ALL SEMICONDUCTOR DEVICE DIODE |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
AXGY | MOUNTING METHOD | TERMINAL ALL SEMICONDUCTOR DEVICE DIODE |
CTRG | CAPACITANCE RATING IN PICOFARADS | 0.17 MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE |
AGAV | END ITEM IDENTIFICATION | WGU-2C/B GUID E/I FSCM 96214 |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
PRMT | PRECIOUS MATERIAL | GOLD |
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