You are currently exploring our in-stock options for part number AT28HC291 55LM 883 with the NSN 5962013584068. This product is listed with the description “Microcircuit Memory” and is manufactured by Atmel Corporation. If you are looking to purchase this part, we encourage you to complete and submit the RFQ form below with as much information as you can provide, such as your desired quantity, budget, shipping time frame, and more. Within 15 minutes of receiving and reviewing your submission, one of our experts will reach out with a quote that is tailored to your needs.
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We supply all relevant information alongside the listings on our website, that way you know you are always getting the exact item you require. For example, part number AT28HC291 55LM 883 is listed alongside the NSN 5962-01-358-4068 and belongs to the FSC 5962 Microcircuits Electronic. Additionally, it is also under the CAGE Code 1FN41, which is assigned to Atmel Corporation. At Aerospace Procurement, you can trust that each product in our inventory is up to industry standards, as we are committed to various quality assurance practices. For example, we uphold a strict NO CHINA SOURCING pledge to ensure that each part is shipped out alongside its manufacturer trace documentation and qualifying certifications. These practices and more allow us to operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Get in contact with us today to see how we can make the procurement process for part number AT28HC291 55LM 883 seamless.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-358-4068 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013584068 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 330874-002 | 2 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 80.00 MILLIAMPERES REVERSE CURRENT,DC ABSOLUTE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 440.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CSWJ | WORD QUANTITY | 8192 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM DELAY |
| CZER | MEMORY DEVICE TYPE | PROM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CRHL | BIT QUANTITY | 65536 |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ERASABLE AND ELECTROSTATIC SENSITIVE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
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